Course details
This subject provides fundamentals of complementary metal-oxide-semiconductor (CMOS) processes and process integration. It covers the principles of various wafer fabrication processes, the causes of various fabrication-related integrated circuit (IC) defects, the working principles of fabrication equipment, as well as CMOS process integration.
Objectives
The subject aims to equip students with knowledge and skills to:
- explain the fundamental principles of various wafer fabrication processes.
- simulate and run various wafer fabrication processes.
- produce process sequences used for CMOS IC process integration.
Course Location
About Temasek Polytechnic
The TP family is a caring one, held together by the poly-wide system known as the Campus Care Network where lecturers and students provide support for each others' needs. Students have access to many state-of-the-art facilities, from computer labs and media studios to our sports complex and Olympic-sized swimming pool. These facilities augment the education our students receive to ensure they graduate as well-rounded, industry-ready professionals. Temasek aims to prepare school-leavers and working adults for a future of dynamic change, with relevant knowledge, life-long skills, character, and a thirst for continuous improvements.
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