Perform Engineering Simulation for the Electronics Industry Bishan, Central

Course details

This module, focusing primarily on applications in the Electronics industry, is recommended for engineers who wish to perform engineering analyses related to Electronics products and processes. The standard stipulates how to:

• Perform, evaluate and optimize high frequency electromagnetic analyses.
• Analyze thermal response of structures and components, focusing on performing steady-state, transient, linear and nonlinear thermal analyses
• Evaluate cooling solutions with air flow dynamics for their device designs apart from optimizing the performance.
• Perform drop test analyses in order to investigate and validate the failure of products

WHO SHOULD ATTEND

This training course is intended for engineers in the Electronics industry who are required to perform engineering simulation to validate their designs.

PRE-REQUISITES

Engineering knowledge is required. Familiarity with computer (PC or workstation) and knowledge of Computer Aided Engineering (CAE) tools will be useful.

COURSE SYLLABUS

• Analyse high frequency electromagnetic analyses
• Use the features of HFSS graphical interface
• Complete geometry creation and meshing in HFSS
• Carry out high frequency electromagnetic analyses using Advanced Solver and HPC
• Apply boundary conditions and excitations in HFSS
• Complete solution parameters and analysis setup in HFSS
• Complete advanced modelling and meshing in HFSS
• Evaluate and conduct antenna postprocessing and fields calculator in HFSS
• Analyse using phased array and radar cross section (RCS) in HFSS
• Analyse using Integral Equation (IE) solver in HFSS
• Analyse using Ansoft Designer for antenna design
• Fundamentals of Heat Transfer Analysis
• Nonlinear Thermal Analysis
• Transient Analysis
• Radiation Heat Transfer Analysis
• Phase Change Analysis
• Fundamentals of Electronics Thermal Analysis
• Geometry Creation and Meshing methods
• Board Level Simulation Analysis
• Basic Meshing & Non-Conformal Meshing
• Solution Settings
• Transient Analysis
• Optimisation Setup and Parameters Setting
• Radiation Analysis on PCB
• Zoom-in Modeling Analysis
• MCAD/ECAD Import Options
• Plasticity Definitions
• Contact and Transient Phenomena for Drop Test Analysis
• Nonlinear Static Analysis
• Dynamic Analysis
• Import or Create Model for Analysis
• Drop Test Analysis
• Solving Solution
• Post-Processing of Results