Course details
This subject gives an overall view of the complete Integrated Circuit (IC) manufacturing process. It introduces the related equipment and facility systems for crystal growth, wafer fabrication, IC assembly and electrical testing. The various manufacturing issues such as quality, safety, in-line process monitors, contamination, manufacturing defects and some aspects of IC failure analysis and reliability will be discussed. The subject also covers test specifications, test generation, characterization tests, tester interfaces and the modules of a typical test system.
Objectives
The subject aims to equip students with the knowledge and skills to:
- address various IC assembly and packaging process issues.
- apply various failure analysis techniques in the IC assembly process.
- develop test program for testing semiconductor devices.
Course Location
About Temasek Polytechnic
The TP family is a caring one, held together by the poly-wide system known as the Campus Care Network where lecturers and students provide support for each others' needs. Students have access to many state-of-the-art facilities, from computer labs and media studios to our sports complex and Olympic-sized swimming pool. These facilities augment the education our students receive to ensure they graduate as well-rounded, industry-ready professionals. Temasek aims to prepare school-leavers and working adults for a future of dynamic change, with relevant knowledge, life-long skills, character, and a thirst for continuous improvements.
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